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Comparative study on the thermal performance of surface‐mounted devices light‐emitting diode packaging with poly(1,4‐cyclohexylenedimethylene terephthalate) and epoxy moulding compound frames
IET Optoelectronics ( IF 1.6 ) Pub Date : 2021-05-26 , DOI: 10.1049/ote2.12044 Dezhi Zhao 1 , Zhihua Xiong 1 , Cong Chen 1 , Yunfei Niu 2
中文翻译：
聚对苯二甲酸1,4-环己二亚甲基酯与环氧模塑料框架的表面贴装器件发光二极管封装的热性能比较研究
更新日期：2021-05-26
IET Optoelectronics ( IF 1.6 ) Pub Date : 2021-05-26 , DOI: 10.1049/ote2.12044 Dezhi Zhao 1 , Zhihua Xiong 1 , Cong Chen 1 , Yunfei Niu 2
Affiliation
中文翻译：
聚对苯二甲酸1,4-环己二亚甲基酯与环氧模塑料框架的表面贴装器件发光二极管封装的热性能比较研究
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