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Reactive silver inks: a path to solar cells with 82% less silver
Energy & Environmental Science ( IF 32.5 ) Pub Date : 2024-04-10 , DOI: 10.1039/d4ee00020j
Michael W. Martinez-Szewczyk 1 , Steven J. DiGregorio 2 , Owen Hildreth 2 , Mariana I. Bertoni 1
Affiliation  

Silicon heterojunction (SHJ) cells currently hold the efficiency record for crystalline silicon (c-Si) based devices of 27.09% and continue to show a promising pathway towards the practical limit of 28.5%. The efficiencies of these cells are typically limited by two main components that are closely related: the resistive losses of the contact layers across the device and the shading losses of the metallization. As the widths of the contacts are reduced to minimize shading, the resistive losses of these narrower contacts become increasingly important to manage. The higher resistivity of the low-temperature silver paste (LT-SP) grid metallization is a direct result of what is required to meet the low temperature compatibility requirements set by the amorphous silicon layers. Reactive silver ink (RSI) coupled with dispense printing offers a path to fabricate low-temperature metallization contacts with pure metal-like properties while using 82% less silver than LT-SP (16.4 mgAg vs. 89.2 mgAg). Here we present the potential of this advanced metallization, which has a unique contact geometry and can yield a total resistivity of 3.1 μΩ cm and contact resistivity of 3.2 mΩ cm2. This results in an efficiency gain of 1.1%abs when using an identical grid design as the LT-SP metallization. In addition, power loss analysis of the devices is performed and demonstrates how RSI metallization can achieve higher efficiencies than 22.29%, which is 2.09%abs above the LT-SP baseline by redesigning the contact grid and TCO optimization.

中文翻译:

活性银油墨:减少银含量 82% 的太阳能电池之路

硅异质结 (SHJ) 电池目前保持着晶体硅 (c-Si) 器件 27.09% 的效率记录,并且继续向 28.5% 的实际极限显示出有希望的途径。这些电池的效率通常受到两个密切相关的主要因素的限制:器件上接触层的电阻损耗和金属化的遮蔽损耗。随着触点宽度的减小以最大限度地减少阴影,这些较窄触点的电阻损耗的管理变得越来越重要。低温银浆 (LT-SP) 栅极金属化的较高电阻率是满足非晶硅层设定的低温兼容性要求的直接结果。反应性银墨水 (RSI) 与点胶印刷相结合,提供了一种制造具有纯金属特性的低温金属化触点的途径,同时比 LT-SP 的银用量减少 82%(16.4 毫克 89.2 毫克)。在这里,我们展示了这种先进金属化的潜力,它具有独特的接触几何形状,可以产生 3.1 μΩ cm 的总电阻率和 3.2 mΩ cm 2的接触电阻率。当使用与 LT-SP 金属化相同的栅极设计时,这会导致 1.1%绝对效率增益。此外,还对器件进行功率损耗分析,并展示了 RSI 金属化如何通过重新设计接触网格和 TCO 优化实现高于 22.29% 的效率,比 LT-SP 基线高出2.09%绝对值。
更新日期:2024-04-10
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