We demonstrate a sustainable post-processing of carbon fiber reinforced epoxy polymer (CFRP) composites by air plasma etching that permits regular electroconductive surface patterning through direct Cu galvanic metallization, in contrast to the untreated composite. Our study reveals a significant property dependence of the composite with respect to the position to the fiber/matrix composite surface and treatment. The enhancement in electrical conductivity was not compromised by the lower structural integrity of the composite, as the embedded carbon fibers remained unaffected by the air plasma etching process. The metallized Cu domains on the composite exhibit good hardness and excellent solderability potential. Thus, the electroconductive surface patterning of the composite, preceding galvanic metallization, facilitates the selective deposition of Cu layer domains. This step by step process, relying on the creation of selective electroconductive areas on the composite by plasma etching, enables galvanic metallization. Consequently, it enhances the potential for multifunctional composite applications. The feasibility of galvanic metallization brings new perspectives in selective metallization of composites by allowing the tailoring of the metal layer thickness, microstructure and selection of the metal.

中文翻译：

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通过空气等离子蚀刻后碳纤维增强聚合物的表面图案化和增强的导电性实现选择性铜电镀

我们展示了通过空气等离子蚀刻对碳纤维增强环氧聚合物（CFRP）复合材料进行可持续的后处理，与未经处理的复合材料相比，允许通过直接铜电镀金属化形成规则的导电表面图案。我们的研究揭示了复合材料的性能对纤维/基体复合材料表面的位置和处理的显着依赖性。复合材料较低的结构完整性并未损害导电性的增强，因为嵌入的碳纤维仍未受到空气等离子蚀刻工艺的影响。复合材料上的金属化铜域表现出良好的硬度和出色的可焊性潜力。因此，在电镀金属化之前对复合材料进行导电表面图案化，有利于铜层域的选择性沉积。这一逐步过程依赖于通过等离子蚀刻在复合材料上创建选择性导电区域，从而实现电镀金属化。因此，它增强了多功能复合材料应用的潜力。电镀金属化的可行性通过允许定制金属层厚度、微观结构和金属选择，为复合材料的选择性金属化带来了新的前景。