当前位置：
X-MOL 学术
›
IEEE J. Emerg. Sel. Top. Power Electron.
›
论文详情
Our official English website, www.x-mol.net, welcomes your feedback! (Note: you will need to create a separate account there.)
Hybrid Double-Side Cooled Package for Multichip GaN Power Module with Optimal Current Sharing at High Switching Speed
IEEE Journal of Emerging and Selected Topics in Power Electronics ( IF 5.5 ) Pub Date : 2024-04-30 , DOI: 10.1109/jestpe.2024.3395433 Bingyang Li 1 , Xu Yang 1 , Yilong Yao 1 , Kangping Wang 1 , Laili Wang 1 , Wenjie Chen 1
中文翻译：
适用于多芯片 GaN 功率模块的混合双面冷却封装，可在高开关速度下实现最佳均流
更新日期：2024-04-30
IEEE Journal of Emerging and Selected Topics in Power Electronics ( IF 5.5 ) Pub Date : 2024-04-30 , DOI: 10.1109/jestpe.2024.3395433 Bingyang Li 1 , Xu Yang 1 , Yilong Yao 1 , Kangping Wang 1 , Laili Wang 1 , Wenjie Chen 1
Affiliation
中文翻译：
适用于多芯片 GaN 功率模块的混合双面冷却封装，可在高开关速度下实现最佳均流
京公网安备 11010802027423号