Mechanical contact plays a pivotal role in both industrial and daily life applications. Contact stiffness of a multi-indenter contact interface fundamentally determines force–deformation relations. However, the understanding of the overall contact stiffness from the historical perspective is limited owing to inherent difficulties in precisely characterizing the interaction in multi-indenter contacts. In this study, the mechanical strong interaction among indenters is pinpointed. A theoretical model for accurately determining the contact stiffness of multi-indenter contact interface is developed. The physical mechanism of the contact stiffness of multi-indenter contact interface is revealed. The theoretical model is solidly validated by experiment and simulation. More importantly, the present theoretical model can predict the contact stiffness of contact interfaces with complex and irregular configurations, which may be filled up with indenters of hierarchical structures. The critical load is determined to guarantee the finished product rate during transfer printing. This is experimentally evidenced by the transfer printing of silicon wafers with complexly customized patterns. The present study provides a profound guidance for various engineering applications such as fabrication and integration of micro- and nano-electronic chips as well as electronic devices.

中文翻译：

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多压头接触界面的接触刚度


机械接触在工业和日常生活应用中都起着至关重要的作用。多压头接触界面的接触刚度从根本上决定了力-变形关系。然而，由于精确表征多压头接触相互作用的固有困难，从历史角度对整体接触刚度的理解是有限的。在这项研究中，精确定位了压头之间的机械强相互作用。建立了精确确定多压头接触界面接触刚度的理论模型。揭示了多压头接触界面接触刚度的物理机制。该理论模型得到了实验和仿真的充分验证。更重要的是，该理论模型可以预测具有复杂和不规则结构的接触界面的接触刚度，这些接触界面可能填充有分层结构的压头。确定临界负荷是为了保证转移印花时的成品率。具有复杂定制图案的硅晶片的转印已通过实验证明了这一点。本研究为微纳电子芯片和电子器件的制造和集成等各种工程应用提供了深刻的指导。