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A dual function flexible sensor for independent temperature and pressure sensing
Chemical Engineering Journal ( IF 15.1 ) Pub Date : 2024-05-10 , DOI: 10.1016/j.cej.2024.152135
Runcheng Hu , Jianhao Li , Fengming Wu , Zean Lu , Chenghao Deng

Temperature and pressure sensing are two primary goals of bionic electronic skin. In this work, we developed a dual function flexible sensor, which achieved independent temperature and pressure sensing, with easy fabrication and without complicate signal decoupling. For this sensor, two flexible films with conductively bionic microstructure on the surface are combined face to face, which were replicated from rose petal and mulberry leaf. TiCT nanoflakes were mixed with PEDOT: PSS as conductive layer and thermoelectric layer, and the performance of which can be optimized by regulating the concentration of TiCT. The principles for temperature and pressure sensing are thermoelectric and piezo-resistive respectively, which are isolated by structure design. The change of contact area and resistance between the two micro-structured layers upon pressure determines the pressure response of the device. The thermoelectric response in one layer realizes the temperature sensing. The metallic conductivity of TiCT is insensitive to temperature, leading to the invariable electric response to pressure upon varied temperature. The microstructure buffers most of the pressure, which keeps the substrate unchanged and results in the independent thermoelectric response upon varied pressure. This dual function sensor shows robust and repeatable response, and exhibits great application potential in flexible electronics.

中文翻译:


用于独立温度和压力传感的双功能柔性传感器



温度和压力传感是仿生电子皮肤的两个主要目标。在这项工作中,我们开发了一种双功能柔性传感器,它实现了独立的温度和压力传感,且易于制造且无需复杂的信号解耦。该传感器将两片表面具有导电仿生微结构的柔性薄膜面对面组合在一起,这些薄膜是由玫瑰花瓣和桑叶复制而成的。 TiCT纳米片与PEDOT:PSS混合作为导电层和热电层,通过调节TiCT的浓度可以优化其性能。温度和压力传感原理分别是热电式和压阻式,通过结构设计进行隔离。两个微结构层之间的接触面积和电阻在压力下的变化决定了器件的压力响应。一层的热电响应实现了温度传感。 TiCT 的金属电导率对温度不敏感,导致温度变化时对压力的电响应不变。微结构缓冲了大部分压力,使基材保持不变,并在变化的压力下产生独立的热电响应。这种双功能传感器表现出强大且可重复的响应,并在柔性电子产品中展现出巨大的应用潜力。
更新日期:2024-05-10
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