Aluminum scandium alloys and their intermetallic phases have arisen as potential candidates for the next generation of electrical interconnects. In this work, we measure the in-plane thermal conductivity and electron–phonon coupling factor of aluminum scandium alloy thin films deposited at different temperatures, where the temperature is used to control the grain size and volume fraction of the Al3Sc intermetallic phase. As the Al3Sc intermetallic formation increases with higher deposition temperature, we measure increasing in-plane thermal conductivity and a decrease in the electron–phonon coupling factor, which corresponds to an increase in grain size. Our findings demonstrate the role that chemical ordering from the formation of the intermetallic phase has on thermal transport.

中文翻译：

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与固溶体相比，铝钪金属间相 (Al3Sc) 的热导率更高，电子声子耦合系数更低


铝钪合金及其金属间相已成为下一代电气互连的潜在候选者。在这项工作中，我们测量了在不同温度下沉积的铝钪合金薄膜的面内热导率和电子声子耦合因子，其中温度用于控制Al3Sc金属间相的晶粒尺寸和体积分数。随着 Al3Sc 金属间化合物的形成随着沉积温度的升高而增加，我们测量到面内热导率的增加和电子声子耦合因子的降低，这对应于晶粒尺寸的增加。我们的研究结果证明了金属间相形成的化学排序对热传输的作用。